The American chipset maker Qualcomm has unveiled the Qualcomm Immersive Home Platforms that offer dual-band WiFi6 options and high-bandwidth WiFi 6E for mesh-network devices that are expected to debut in 2021. According to the company the platform has been designed to set up gigabit-speed wireless performance to every room in the home. These will be of a palm-size and will be cost-effective too.
“We have launched the Qualcomm Immersive Home platforms, a fresh approach to home networking leveraging high powered Wi-Fi 6 and 6E, a fresh architectural design customized for home deployments, and advanced features designed to deliver Gigabit performance to every corner of the home,” said Nick Kucharewski, vice president and general manager, Wireless Infrastructure & Networking, Qualcomm Technologies, Inc. “Today, as offices, classrooms, movie theatres, and everything in-between move into the home, high-performance Wi-Fi has transitioned from luxury to mission-critical utility.”
The company has introduced a total of four new chipsets and all of them will support 60MHz channels in the 5GHz band. This will include Qualcomm Immersive Home 210 Series and Qualcomm Immersive Home 310 Series. Each of the series will include two chipsets:
Qualcomm Immersive Home 210 Series
- Immersive Home 216 Platform: 6-stream Wi-Fi 6 in a 2×2(2.4GHz) + 4×4 (5GHz) configuration, support 160 MHz channels in 5GHz bands and 160 MHz channels in 5GHz bands
- Immersive Home 214 Platform: 4-stream Wi-Fi 6 in a 2×2 (2.4GHz) + 2×2 (5GHz) configuration and Support for 160 MHz channels in 5GHz bands
Qualcomm Immersive Home 310 Series
- Immersive Home 318 Platform: 8-stream Tri-Band in a 2×2 (2.4GHz) + 2×2 (5GHz) + 4×4 (6GHz) configuration, support for 160 MHz channels in 5/6GHz bands and 4×4 Wi-Fi 6E configuration in the 6GHz band
- Immersive Home 316 Platform: 6-stream Tri-Band in a 2×2 (2.4GHz) + 2×2 (5GHz) + 2×2 (6GHz) configuration and support for 160 MHz channels in 5/6GHz bands
Qualcomm Immersive Home Platforms aims to deliver Gigabit wireless in a form factor highly optimized for size, scale and performance. It can deliver 2.5X throughput per watt – a system-level optimization that keeps industrial designs small, heat profiles cool, and overall device costs low. In addition to this, it will deliver seamless roaming, band/node client steering, and advanced security safeguards across Wi-Fi 4, 5, 6, 6E while also supporting the industry’s leading mesh software protocols including Qualcomm Wi-Fi SON, the OpenSync open-source software and the Wi-Fi Alliance’s Wi-Fi CERTIFIED EasyMesh standard. The platform will deliver Multi-User Traffic Management technologies to balance and support all the Wi-Fi connected devices in a modern smart home, while high-performance Bluetooth integration. Also, it can also reduce latency by up to 8X 8x in congested environments and wireless VR-class latency of <3ms.
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