MediaTek has announced the Dimensity 7300 and 7300X, ultra-efficient 4nm chips designed for high-tech mobile devices offering power efficiency, performance, and dual display support for flip-style devices. These chips offer power efficiency, excellent performance, and enhanced gaming experiences. The octa-core CPU, featuring 4X Arm Cortex-A78 and 4X Arm Cortex-A55 cores, provides up to 25% lower power consumption compared to the Dimensity 7050. The MediaTek APU 655 boosts AI task efficiency and accommodates new mixed-precision data types. The chips support WFHD+ displays with 10-bit true colour and support global HDR standards. The chips also support dual-display flip phones and offer MediaTek 5G UltraSave 3.0+ technology.
The MediaTek Dimensity 7300 chipsets feature an octa-core CPU with 4X Arm Cortex-A78 and 4X Arm Cortex-A55 cores, offering 25% lower power consumption compared to the Dimensity 7050. They also offer 20% faster FPS and 20% improved energy efficiency, smart resource optimisation, and Bluetooth LE Audio support.
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Dimensity 7300 chipsets also provide improved photographic capabilities through the MediaTek Imagiq 950, a high-end 12-bit HDR-ISP that can accommodate a 200MP primary camera. The Dimensity 7300 has been improved with new hardware engines that offer accurate noise reduction (MCNR), face detection (HWFD), and video HDR. This allows users to take beautiful pictures and videos in any kind of lighting. Furthermore, compared to the Dimensity 7050, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster. In addition, 4K HDR video may be recorded with a dynamic range that is more than 50% broader than competing solutions, allowing users to capture more detail in their recordings.
AI task efficiency is doubled by the MediaTek APU 655 compared to the Dimensity 7050. By supporting mixed-precision data types, the Dimensity 7300 processors lower the memory needs for larger AI models. The chips’ integrated MiraVision 955 enhances video streaming and playback by supporting WFHD+ displays with 10-bit true colour and global HDR standards. The Dimensity 7300X satisfies consumer demand for novel form factors by supporting twin-display flip phones.
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With MediaTek 5G UltraSave 3.0+ technology, the Dimensity 7300 and 7300X offer 13–30% more power efficiency than competing products. With 3CC carrier aggregation, they can support up to 3.27Gb/s 5G downlink, which can provide better speeds in urban and suburban environments. For further customer choice, they also include dual 5G SIM compatibility with dual VoNR and tri-band Wi-Fi 6E support.
