Taiwanese semiconductor manufacturer, MediaTek, today expanded its 5G chipset’s portfolio with the addition of two new SoCs. MediaTek Dimensity 920 and Dimensity 810 chipsets are claimed to provide improved performance, imaging as well as displays on the upcoming 5G phones. The former is the successor of Dimensity 900 while the latter succeeds the Dimensity 800.
Dr JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit said, “With the expanded Dimensity chipset series, MediaTek is providing device makers and smartphone users with the latest innovations at a more accessible price points for the mainstream market. Delivering a boost in performance, display intelligence and image brilliance, these new Dimensity chipsets will improve user experiences and deliver advanced 5G features and capabilities to 5G smartphones.”
The MediaTek Dimensity 920 SoC will support intelligent displays and hardware-based 4K HDR video capture, while also offering a 9% boost in gaming performance compared to its predecessor, the Dimensity 900. Whereas the Dimensity 810 SoC will come with Arm Cortex-A76 CPU speeds up to 2.4GHz in its octa-core CPU, the premium camera features including artistic AI-color in collaboration with Arcsoft, and advanced noise reduction techniques for superb low-light photography.
Moreover, the Dimensity 920 comes with Arm Cortex-A78 processors in the octa-core CPU that can reach 2.5GHz clock speeds, along with the latest LPDDR5 memory and UFS 3.1 storage, Dimensity 920 maximizes performance.
It is also capable of adjusting the display refresh rate according to the game or UI action detected, raising it during periods of intense action to improve user experiences and then lowering it to improve power efficiency. It incorporated a flagship-level HDR-native image signal processor (ISP) and unique hardware-accelerated 4K HDR video recording engine that supports up to four concurrent cameras and up to 108MP sensors. The new 5G chipset also supports dual 5G SIM, dual VoNR, up to 2CC carrier aggregation, MediaTek 5G UltraSave power efficiency suite and 5G SA/NSA networking, 2×2 MIMO Wi-Fi 6 connectivity, Bluetooth 5.2 and multi-GNSS. In addition to this, there is support for MediaTek HyperEngine 3.0 with 5G call and data concurrency, plus connection enhancements for high-speed rail and ‘Super Hotspot’ technology.
On the other hand, MediaTek Dimensity 810 SoC will benefit mainstream 5G smartphones while supporting 120Hz displays for an ultra-smooth user experience. In terms of cameras, it can support up to 64MP cameras with support for advanced noise reduction techniques (MFNR & MCTF) for excellent low-light capture. It can also enable AI-Bokeh and artistic AI-Color in collaboration with Arcsoft. Additionally, it will also include MediaTek’s HyperEngine 2.0 gaming technologies with an intelligent resource management engine and advanced networking engine.
According to MediaTek, the latest chipsets will deliver the latest connectivity features including 5G standalone (SA) and non-standalone (NSA) architectures, 5G two carrier aggregation (2CC) including mixed-mode FDD+TDD, dynamic spectrum sharing (DSS) technology support, True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The mobile processors are expected to be shipped in the 5G smartphones in the global market in Q3 2021.
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