Taiwanese semiconductor manufacturer MediaTek has announced the launch of its MediaTek Dimensity 1200 and Dimensity 1100 5G SoCs. Both the chipsets are designed on a 6nm architecture and are highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more. According to the company both 5G processors are facilitated with unrivaled AI, camera and multimedia features for powerful 5G experiences. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and the beginning of Q2 this year.
JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit said, “MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier. Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements.”
The Dimensity 1200 and 1100 equips 5G modem with MediaTek’s 5G UltraSave technology that makes the device energy efficient by big power savings. Thes processor is capable of supports 2G to 5G and provides the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The SoCs also comes integrated with the HSR Mode and 5G Elevator Mode for reliable 5G connection globally.
As per MediaTek, the Dimensity 1200 SoC can support a 200MP camera sensor with its five-core HDR-ISP. In addition to this, it will also support 4K HDR video recording and an updated version of MediaTek’s hexa-core AI processor (MediaTek APU 3.0) that reduces latency and improves power-efficiency.
On the other hand, the Dimensity 1100 SoC will provide support for a 108MP camera and integrate MediaTek’s existing APU 3.0 for high-performance computing that’s also super power-efficient. Both the SoCs are said to bring support for AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.
In terms of performances, the Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz and for extreme performance, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. There is a nine-core GPU and a six-core MediaTek APU 3.0 for premium performance. Whereas Dimensity 1100 comes with an octa-core CPU which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with a nine-core Arm Mali-G77 GPU. Both chipsets are manufactured on TSMC’s advanced 6nm process technology.
On the display front, Dimensity 1200 supports 168Hz refresh rate displays while Dimensity 1100 with 144Hz refresh rates display. According to the company, Dimensity 1200 has already received TÜV Rheinland certification for its 5G performance. However, certification verifies that the chipset provides reliable, high-performance 5G connectivity and offers users high-quality 5G experiences across a wide variety of scenarios.
Both the processors are supported by MediaTek’s HyperEngine 3.0 gaming technologies in addition to 5G call and data concurrency with multi-touch boost touchscreen responsiveness. Furthermore, there will be ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.
In terms of connectivity both the MediaTek chipsets support Bluetooth 5.2 support ultra-low latency true wireless stereo audio and LC3 encoding for higher quality, lower latency streaming audio that’s also very power-efficient to prolong the battery life of wireless earbuds.
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